HP ECPU500 K HCD90 H, P/N 271-4270 F Power Module

Processor Speed:2.0 GHz

Core Count:4

RAM Size:16 GB DDR4

Operating System:Windows 10 IoT Enterprise

Power Consumption:120W

Max Load Capacity:200 Amps

Communication Interface:RS-485, CANopen, EtherCAT

Temperature Range:-20°C to +60°C

Enclosure Material:Aluminum Alloy

Dimensions (WxHxD):170mm x 100mm x 30mm

    Engineered with cutting-edge technology, the HP ECPU500 K HCD90 H P/N 271-4270 F Power Module is the backbone of modern industrial automation systems. It ensures smooth operation under demanding conditions, providing unparalleled performance and reliability.

    Featuring a robust IP54 protection class, this power module is designed to withstand harsh environments, making it ideal for applications in manufacturing plants, power distribution centers, and other industrial settings.

    With an impressive efficiency rating of 98%, our power module optimizes energy usage, leading to significant cost savings on electricity bills without compromising on performance. This is particularly beneficial in industries where energy consumption is a critical factor.

    Equipped with advanced communication interfaces like Modbus RTU and CANopen, the HP ECPU500 K HCD90 H P/N 271-4270 F Power Module facilitates seamless integration with various control systems, enhancing system interoperability and ease of maintenance.

    Our power module operates within a wide temperature range of -20°C to +50°C, ensuring reliable performance regardless of environmental conditions. This versatility makes it suitable for deployment in a variety of climates, from cold workshops to hot data centers.